Isantya esiPhezulu esiZizimelayo esiPheleleyo se-PCB SMT Solder Cola Isishicileli se-PCB SMT Stencil Printer

Inkcazelo emfutshane:

Desen Umatshini Wokuncamathelisa we-Solder ozenzekelayo we-PCB ye-SMT Stencil Printer

Iinkcukacha
1. Ukudibanisa ngokuthe ngqo intloko ye-scraper
2. Inkqubo yothutho ezimeleyo
3. Inkqubo yokucoca intsimbi ezenzekelayo nesebenzayo
4. Ulungiselelo olucocekileyo nolufanelekileyo lokhuseleko lombane
5. Ukusetha isakhelo somnatha esizenzekelayo
6. Ujongano lomsebenzi owenziwe ngabantu


  • FOB ixabiso:US $0.5 - 9,999 / Iqhekeza
  • Min.Ubungakanani boMyalelo:100 Iqhekeza / Iingceba
  • Ubunakho bokubonelela:10000 Iqhekeza/Amaqhekeza ngenyanga
  • Iinkcukacha zeMveliso

    Iithegi zeMveliso

    Umatshini wokushicilela we-solder wanamhlanje ngokubanzi uqulunqwe ngokulayishwa kwepleyiti, ukongeza i-solder paste, i-embossing, ukuhanjiswa kwebhodi yesekethe njalo njalo. Umgaqo wayo wokusebenza ngulo: lungisa kuqala ibhodi yesekethe ukuba iprintwe kwitafile yokubeka indawo, kwaye emva koko i-scrapers yasekhohlo nasekunene yomshicileli ivuza i-solder paste okanye iglu ebomvu kwipadi ehambelanayo nge-mesh yentsimbi. I-PCB ene-uniform engekhoyo yoshicilelo igalelo kwi-mounter ngokusebenzisa itafile yothumelo lokunyuka okuzenzekelayo.

    Amanyathelo okusebenza kwe-SMT yomshicileli ozenzekelayo:
    1. Khangela kwaye uqale izixhobo ngaphambi kokuba usebenze ngokweenkqubo zokusebenza;
    2. Beka i-PCB (i-PCB deformation ayikwazi ukuhlangabezana neemfuno zokuvelisa, kwaye ipleyiti exhasayo iya kongezwa) kwisakhelo sokulayisha;
    3. Beka isikrini kumatshini wokushicilela ngokwesalathiso esikhonjwe lutolo lwesikrini;
    4. Khetha inkqubo yoshicilelo ehambelanayo ngokweemveliso eziveliswayo, ngenisa * * indlela yokulinganisa isikrini, kwaye ulungise imeko yoshicilelo;
    5. Uhlengahlengiso lokushicilela: lungisa isantya sokushicilela, uxinzelelo kunye ne-angle ukwenza inani le-solder paste liprintwe kwi-uniform ye-PCB pad;
    6. Inqaku lokuqala liya kuqinisekiswa yingcali kunye nokuveliswa kobuninzi kuya kuqhutywa emva kokuba ifanelekile;
    7. Zonke iibhodi eziprintiweyo ezingama-30 ziya kuhlolwa ngumhloli kwaye zithunyelwe kwisixhobo sokuxhobisa emva kokuphumelela uhlolo;
    8. Emva kokusebenza, susa ibhodi yesikrini kwaye uyicoce, uyivale ngokweenkqubo zokusebenza, kwaye uhlambulule i-worktable.

    Iimfuno ze-SMT umshicileli ozenzekelayo:

    1. Nxiba iiglavu zerabha okanye iiglavu ezilahlwayo xa usebenzisa i-solder paste. Ukuba i-solder paste ibambelele ngengozi esikhumbeni, yihlambulule ngokukhawuleza ngotywala kunye ne-sanitizer yesandla, uze uyihlambulule ngamanzi amaninzi;

    2. I-solder paste eseleyo, iphepha elisetyenzisiweyo lokusula isikrini kunye neeglavu ezilahlayo emva kokusebenza ziya kunyangwa ngokuhambelana nemimiselo efanelekileyo yemimiselo yendalo;

    3. Coca izixhobo, izixhobo kunye nezixhobo phambi kokusetyenziswa, ngakumbi nikela ingqalelo ekhethekileyo kwimeko yokhuseleko lokusingqongileyo kwindawo phambi kokuba kusetyenzwe iimveliso ezingenalothe.

    Iiparamitha zePCB

    Umzekelo DSP-1008
    Ubungakanani bebhodi enkulu (X x Y) 400mm×340mm
    Ubuncinci bebhodi yebhodi 50mm×50mm
    PCB ubukhulu 0.4 - 5mm
    Iphepha leWarpage ≤1% Diagonal
    Ubunzima bebhodi ephezulu 0-3kg
    Isikhewu somda webhodi yi-20mm
    Isantya sokutshintshela 1500mm/s(Ubukhulu)
    Ukutshintshela ubude ukusuka emhlabeni 900±40mm
    Isalathiso sokutshintshela kwi-orbit eKhohlo-Ekunene, Ekunene-Ekhohlo, Ekhohlo-Ekhohlo, Ekunene-Ekunene
    Imowudi yokuGqithisela inqanaba elinye lokujikeleza
    I-PCB yendlela yokudambisa i-PCB elungisekayo Uxinzelelo lwecala olunoguquguqukayo + Ubukhulu bebhodi yePCB eguquguqukayo + i-Edge lock base clamp (NgoKhetha: 1. I-vacuum yamanqaku amaninzi asezantsi; 2. Isitshixo seEdge kunye ne-substrate clamping)
    Indlela yenkxaso yeMagnetic thimble, ibhloko elinganayo ephezulu, njl.njl.
    Iiparamitha zokuSebenza

    Ukuphindaphinda ukuchaneka kolungelelwaniso lomfanekiso ±10.0μm @6 σ,Cpk ≥ 2.0
    Ukuphindaphinda ukuchaneka koshicilelo ±20.0μm @6 σ,Cpk ≥ 2.0
    Ixesha lomjikelo<7s(Ngaphandle kokuprinta kunye nokucoca)
    Ukutshintshwa kwemveliso<5mins<br /> Iiparamitha zomfanekiso

    Indawo yokujonga 8mm x 6mm
    Uluhlu lohlengahlengiso lweqonga X: ± 5.0mm, Y: ± 7.0mm, θ: ± 2.0 °
    Indawo yebenchmark Uhlobo lwemilo esemgangathweni yebenchmark point(SEMA standard),solder pad/openings
    Inkqubo yekhamera Ikhamera ezimeleyo,indlela yokubona phezulu/ezantsi
    Iiparamitha zoShicilelo

    Intloko yoshicilelo Intloko yoshicilelo edadayo (injini ezimbini ezizimeleyo eziqhagamshelwe ngokuthe ngqo)
    Ubungakanani besakhelo setemplate 470mm x 370mm~737 mm x 737 mm
    Eyona ndawo yokushicilela (X x Y) 450mm x 350mm
    Uhlobo lwe-Squeegee I-Steel scraper / i-Glue scraper (Ingelosi 45 ° / 50 ° / 60 ° ehambelana nenkqubo yokushicilela)
    Ubude be-Squeegee 300mm (ukhetho kunye nobude be-200mm-500mm)
    Ubude be-Squeegee 65±1mm
    Ubungqingqwa be-Squeegee 0.25mm I-Diamond-efana nekhabhoni yokwaleka
    Imowudi yoshicilelo Ushicilelo olunye okanye oluphindwe kabini lwe-scraper
    Ubude be-Demoulding 0.02 mm - 12 mm
    Isantya sokushicilela 0 ~ 200 mm/s
    Uxinzelelo lokushicilela 0.5kg - 10Kg
    Ukuprinta istroke ±200 mm (Ukusuka embindini)
    Iiparamitha zokucoca

    Imodi yokucoca 1. Inkqubo yokucoca i-drip; 2. Iindlela ezomileyo, ezimanzi kunye ne-vacuum
    Ubude bokucoca kunye nokusula ibhodi 380mm (ukhetho kunye ne-300mm, 450mm, 500mm)
    Izixhobo

    Iimfuno zamandla 220±10%,60/60HZ-1¢
    Iimfuno zomoya ezixinisiweyo 4.5~6Kg/cm2
    Ubungakanani bangaphandle 1114mm(L)*1360mm(W)* 1500mm(H)


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