Ukusetyenziswa ngokuzenzekelayo kwi-SMT Solder Paste yokuHlola uMtshini we-3D SPI
Imodeli ye-KY8080
Umsebenzi Ukumelana nobushushu obuphezulu
Ibakala oluzenzekelayo oluzenzekelayo
Ubungakanani bomatshini 800 * 1335 * 1627mm
Ubungakanani beBhodi Indlela enye 50 × 50 - 350 × 330mm
Indlela emibini 50×50 - 350×580mm
Fov Ubungakanani 36 * 36mm
Amandla 220V,10A
Ubunzima Indlela enye: 600kgs
Iindlela ezimbini: 650kgs
Lonke uxinzelelo 4-6 bar
Ubukhulu bokulayisha ubukhulu bePCB X330*Y350mm
Isiqinisekiso CE.ISO.RoHS
Ipakethi yePhakethi yoMgangatho wepakethe yeplanga
Imilinganiselo: umthamo, i-acreage, ubude, i-XY offset, imilo
Ukufunyanwa kweentlobo ezingaSebenziyo ezilahlekileyo, itoti enganelanga, itoti egqithisileyo, ibhuloho, i-offset, iimilo ezimbi, ukungcoliseka komphezulu
Ukulungiswa kweLens 4.5um/5um/6um/8um/10um/12um/15um/16um/18um/20um
Ukuchaneka:XY (Isigqibo) 20um
Ubude bokuphinda: ≤1um (3 Sigma); ivolyum/acreage:<1%(3 Sigma)
IGage R&R<<10%<br /> Ukuhlola Isantya 0.35sec/FOV-0.5sec/FOV
Ixesha lokuFumana inqaku 0.3sec/piece
Ubuninzi beNtloko yokulinganisa ±550um (±1200um njengokhetho)
Ubungakanani obukhulu bokuMeta ubude bePCB Warp ±5um
Ubuncinci beSithuba sePad 100um
Ubuncinci bento 01005/03015/008004 01005/03015/008004
Ubungakanani obukhulu bokuLayishwa kwePCB(X*Y) 450x500mm(B) 470x500mm (C) 630x686mm
Ukuchaneka kokuphinda-phinda kwezixhobo<10% (5 Sigma)
